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ADVANCED ELECTRONIC PACKAGING MULTICHIP MODULES BROWN HARDCOVER

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ADVANCED ELECTRONIC PACKAGING MULTICHIP MODULES BROWN HARDCOVER

$19.99
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HAS SMALL COMPANY STAMP ON ONE OF THE FIRST BLANK PAGES.

TITLE OF BOOK:

ADVANCED ELECTRONIC PACKAGING WITH EMPHASIS MULTICHIP MODULES

AUTHOR(S): EDITED BY WILLIAM D. BROWN 1999

HARDCOVER

PUBLISHER: IEEE PRESS



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